General purpose gap filler pad ul94 v 0 class.
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With a 11 0 watt mk thermal conductivity these pads will pull heat away from your important components with ease and allow for overclocking as well.
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The putty like material exhibits a high thermal conductivity and low thermal resistance while conforming to even the smallest protrusions and depressions on components to make complete.
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High performance gap filler.
Buy fujipoly extreme system builder thermal pad 60 x 50 x 1 5 thermal conductivity 11 0 w mk.
General purpose gap filler pad ul94 v 0 v 1 class.
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The extreme thermal pad is a ready to use high end thermal pad.
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Thermal impedance of semiconductor mounted to substrate with gap filler pad is eliminated yielding higher temperature gradient.
Fujipoly is the leader in the design formulation and production of high performance thermal interface materials elastomeric connectors and custom silicone extrusions.
As shown above even the most highly polished mating surfaces do not make reliable contact surfaces.
This line of thermal pads are much more effective than stock pads.
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These are custom cut to a smaller more applicable size.
It is ideally suited for applications requiring low compression force on the component.
Thermal impedance of semiconductor mounted to substrate is appreciably increased at junction of porous surfaces.
Very high thermal conductivity gap filler pad 8 00.
We operate a global network of 9 manufacturing and distribution centers to deliver you unprecedented product performance and dependability.
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